Dry Etch Engineering Area Manager – Ocotillo Technology Fabrication, May ‘19 – July ‘21 Responsible for all engineering and business operations for managing 3 different dry etch groups spanning 10/14/22nm tech nodes. I manage a 225-230 people diverse group that contributes to ~2B+/year in revenues to Intel. I am primarily responsible for all aspects (Safety, Quality, Output/Capacity, Cost, and People development) in a 24x7 operations. • Managed/Sustained ~50% tools in the area (310 tools across 15 different types and platforms) demonstrating sustaining excellence. Built/Maintained excellent relationship with multiple equipment vendors, VF partners, and stakeholders to partner/achieve excellent results. • Led the modules to world-class safety performance reducing injuries by 50%, BIC quality (~$40M/year better than Fab24) and cost performance (~$1.5M better than Fab24) in the modules. • Improved capacity (~12%) on the limiter toolsets by implementing creati

Country Head, Technology Manufacturing Group-India, Intel Technology India Pvt. Ltd., Jan. ’06 – May ‘19 Responsible for all engineering and business operations for all the TMG-TD groups at India site leading a group of 575+ employees (Fulltime, Interns, and multiple Vendors) across various functional groups for TMG-TD like ATTD, LTD (Advanced Design, Compiler Development, Standard Cell Library Development), ICF/TPD, CQN, CPLG etc. • Managed development, deployment, and support of Automation products across Fab/Sort/Assembly/Test. Delivered automation products across 6 main technology nodes to enable on-time product releases and engineering improvements to meet output/cost targets. • Initiated/Drove efforts to develop strategies and influence senior management for initiating, seeding, growing, and expanding the business groups to make new investments to establish centers at India site. • Led several site-wide efforts that had huge business impact like leading the site-wide retentio

Process Engineering Manager, Fab 22, Intel Corporation, Chandler, AZ. Jan. ’01 – Oct. ‘04 Responsible for Dry Etch Engineering solutions (Safety, Quality, and Cost-effective Output) for P860/P861 processes. Started on 1260/1262 process development. • Responsible for growth and development of engineers and engineering technicians in Fab22 dry etch (the largest) area within Fab22 Process Engineering. • Managed the entire etch Module Team. Duties included planning/direction setting, overseeing execution of roadmaps to achieve outstanding results for Safety, Quality, and Cost-effective Output in the area. • Acting Litho/Etch Department manager for over 6 months where I was directly responsible for day-to-day operational activities of the factory in Litho/Etch areas. • Etch Roadmap Team and Shared Learning Group chair for VF etch teams providing leadership via direction setting and shared learning across VF sites. • Responsible for technology transfers from TD sites to Fab22 and from Fab

Senior Process Development Engineer, SiTR (KFab), Texas Instruments, Inc., Dallas, TX. Apr. ’99 – Jan. ‘01 Incharge of BEOL plasma etch processes for C05/C035 technology nodes (Aluminum and Copper). • Responsibilities included managing a small group of engineers and technicians for process characterization and implementation, new technology introduction, new tool evaluation and tool start-up, process control and yield enhancement, vendor interface and joint development project management to release next generation technologies/products to market. Developed and qualified novel, robust, and high yielding Semi-conductor Plasma Etch Processes for new technology nodes. Lead Process Engineer, Digital Imaging, Texas Instruments, Inc., Dallas, TX. Oct. 95 – Mar ’99 Incharge of plasma module for the fabrication of Digital Micromirror Device (DMDTM) using MEMS technology. • Responsibilities consisted of developing new, stable, and robust processes and resolving critical process issues to

• Design, fabrication, and in-vivo/in-vitro testing of state-of-the-art thin-film four/sixteen channel gold/platinum microsensors used for electrochemical and electrophysiological recordings. • Characterized the effects of Fluorination, Hydrogen Dilution, Nitrogen Doping, Nitrogen Implantation and RTP on the growth and properties of PECVD Diamond-like Carbon films. • Fabricated BJT and MOS devices, and successfully tested/studied the characteristics. • Designed, implemented, and successfully tested a Mead-Conway Arithmetic Logic Unit, Character Recognition Chip, and DNA Pattern Match Chip. Used Mentor-Graphics, Powerview, and Magic to simulate and lay out the design.

Responsible for Designing and Managing multiple courses in Semi-conductor concepts and various management classes. I have taught multiple classes at multiple colleges and trained >300 students. Involved in all aspects of being a faculty member like designing and modifying courses to include new concepts, teaching, grading, conducting exams etc. Have received several accolades for excellent teaching very high instructor ratings.

TCM Engineering Area Manager – Corporate Services, AZ, July ’21 – Present Responsible for Total Chemical Management group that ensures 100% reliable distribution of all the chemicals and gases to the entire manufacturing network at Ocotillo Site that spreads across all 4 mega factories spanning all the 5/10/14/22nm tech nodes. I manage a large diverse group that contributes to ~25B+/year in revenues for Intel. I am primarily responsible for all aspects (Safety, Quality, Output/Capacity, Cost, and People development) in a 24x7 operations. • Manage/Sustain the Bulk Chemical and Gas (Spec Gas and Bulk Gas) delivery systems to ensure reliable and uninterrupted 24x7 operations of entire factories at the OC site. Interface with the entire supply chain dealing with internal and external stakeholders to serve 1000s of tools with chemicals that are necessary for uninterrupted manufacturing operations. Built/Maintained excellent relationship with multiple suppliers/vendors, intermediaries